Highest output, highest ROI, highest flexibility, compact inline system
Unit-i4 is a new generation of selective wave soldering with the following features:
2 drop jet fluxers
Bottom IR preheating
2 solder pots in two individual wave tunnels, each with two wave tunnels
The PCB is moved by a conveyor, the conveyor table moves in X/Y, the solder pot/fluxer movies in Z
Windows 10 system
3-axis full servo drive with ball screw movement
Standard equipped with wave height calibration
Real-time soldering process monitor
Unit-i4 Specifications | |
---|---|
Item | Unit-i4 |
General | |
Operating power/Max power | 6KW/22KW |
Machine dimension | 1300(L)*1840(W)*1200(H) |
Net weight | 700KG |
Power supply | 3PH 380V 50HZ |
Air supply | 3-5 bars |
Exhausting required | 800M3/h |
PC | Yes |
Typical Program Time | 10 Minutes |
Conveyor | |
PCB dimension | W50xL50---W508xL508mm(single nozzle soldering) W50xL50---W508xL250mm(two nozzle soldering parally) W50xL50---W250xL250mm(four nozzles soldering parally) |
PCB Clearance | Top 95mm bottom 30mm |
PCB Weight | Max 5kg |
Conveyor width | Auto |
Conveyor assembling motion | X,Y motion with server motor/driver |
PCB Robotic Platform | |
Flux Nozzle Type | Drop jet fluxer |
Flux Nozzle Quantity | 2 |
Flux Tank Capacity | 1L |
Flux Tank Quantity | 2 |
Flux Nozzle Distance | adjustable |
Preheat | |
Preheating method | Bottom IR heater |
Solder Management | |
Solder pot type | mechanical pump |
Standard Solder Stations | 2 |
Solder Pot Capacity | 30 kgs |
Solder Temperature Control | PID |
Heat-UpTime | About 30mins |
Max Temperature | 350 ℃ |
Wave tunnel | 4pcs (2pcs per solder pot) |
Mini Wave Nozzles | Dia 3to12mm |
Customized nozzle | Available |
Axes of Motion | Z1, Z2 |
(N2) Inertion Management | |
N2 Consumption per Nozzle | 6--8m3/H |
Required N2 Purity | >99.99% |